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半导体量子芯片及其制备方法Release time:2025-06-14 Hits:
Disigner of the Invention: 曹刚,康原,李宗祜,陈明博,李海欧,郭光灿,郭国平
Authorization number: ZL202011610005.8
Service Invention or Not: no
Application Date: 2020-12-29
Authorization Date: 2024-08-30
半导体量子芯片及其制备方法
Release time:2025-06-14 Hits:
Disigner of the Invention: 曹刚,康原,李宗祜,陈明博,李海欧,郭光灿,郭国平
Authorization number: ZL202011610005.8
Service Invention or Not: no
Application Date: 2020-12-29
Authorization Date: 2024-08-30
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